design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. metal film thermosensitive chip resistors e 1 r 2 a 3 s 4 1 5 5 6 j 7 1 8 0 9 3 10 v 11 metal film chip resistors product code size, power rating type: inches w: 0402 v: 0603 s: 0805 0.031 w 0.063 w 0.1 w power rating resistance tolerance code j tol. 5% resistance value temperature coefficient of resistance code type 15 27 33 39 erav, eras eraw, erav, eras eraw, erav, eras erav, eras 1500 2700 3300 3900 ( 10 ? / c ) packaging methods code x v packaging type punched carrier taping 2m mp itch, 10,000 pcs. eraw erav eras punched carrier taping 4m mp itch, 5,000 pcs. the first two digits are significant figures of resistance and the third one denotes number of zeros following. decimal point is expressed by ? ? (ex.) 103 : 10 k 6r8 : 6.8 a b t w l (1) dimensions in mm (not to scale) type (inches) dimensions (mm) mass (weight) [g/1000 pcs.] lwa b t eraw (0402) 1.00 ?.07 0.50 ?.05 0.15 ?.10 0.25 ?.07 0.35 ?.05 0.6 erav (0603) 1.60 ?.20 0.80 ?.20 0.30 ?.20 0.30 ?.20 0.45 ?.10 2 eras (0805) 2.00 ?.20 1.25 ?.10 0.40 ?.25 0.40 ?.25 0.50 ?.10 4 metal film thermosensitive chip resistors 0402, 06 03, 0805 type: eraw, v, s features suitable for temperature correction circuits temperature coef? cient value 1500 to 3900 10 ? / c high performance quick response to tem per a ture change linearity excellent linear resistance val ue change in wide temperature range (?0 c to +125 c) high reliability, high density placing small size and lightweight for pwb size reduction and lightweight products suitable for both re? ow and ? ow soldering reference standards iec 60115-8, jis c 5201-8, eiaj rc-2145 rohs compliant explanation of part numbers construction protective coating alumina substrate electrode (inner) electrode (between) thermosensitive element electrode (outer) 1) marking temperture coef cient value : 2 signi cant gure 100 10 ? / c eraw type is no marking. oct. 2010 00
metal film thermosensitive chip resistors design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. 0 40 20 0 20 40 60 80 100 120 140 20 40 60 80 100 120 rated load (%) ambient temperature( c) 70 c 125 c 30 40 25 0 25 50 75 100 125 20 10 0 10 20 30 40 50 60 resistance change (%) ambient temperature ( c) 3900 10 ? / c (ppm/ c) 2700 10 ? / c (ppm/ c) 1500 10 ? / c (ppm/ c) type (inched) power rating at 70 c (w) standard speci? cation (1) t.c.r. tolerance re sis tance tolerance (%) standard resistance values t.c.r. ( 10 ? / c) (2) resistance rang e ( ) eraw (0402) 0.031 2700 3300 43 to 1 k 22 to 390 ?0 % 5 e12 erav (0603) 0.063 1500 10 to 10 k 200 10 -6 / c ? e12 2700 3300 3900 43 to 3.3 k 22 to 1.2 k 7. 5 to 3 9 0 ?0 % eras (0805) 0.1 1500 10 to 10 k 200 10 -6 / c ? e12 2700 3300 3900 43 to 5.1 k 22 to 1.8 k 6.2 to 470 ?0 % r 75 -r 25 r 25 1 75 25 (2) t. c.r.= { 10 6 } 10 ? / c r 25 : re sis tance valu e at refe rence temper ature 25 c r 75 : re sis tance valu e at temperature 75 c power derati ng curve for resistor s operated in ambient tem per a tures above 70 c, power rating shall be derated in accordance with the ? gure on the right. typical linearity of resistance change category temperature range 40 c to +125 c ratings (1) please as k us when resistors other than standard spec i ? ca tion shown in the ab ove table are needed. sep. 2010 00
design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. metal film thermosensitive chip resistors t a p 0 p 2 p 1 p 1 d 0 b f w e (2 mm pitch) n w 2 w 1 a c c a b chip resistor punched carrier attention this product has high temperature coef cient. wh en mea sur ing resistance, the resistance value can change due to joule heating. therefore, the mea sur ing current shall be very small in order to prevent the resistance value from changing. (for example, when the resistor is used at rcwv, temperature of the re sis tor rise ab out 15 c and the resistance value rise a few percents.) resistance value ma y also change due to the ambient tem per a ture. resistance value is me asured at 25 c. recommended land pattern anexample of a land pattern to metal film thermosensitive chip resistors is shown below. example packaging methods (taping) standard quantity taping reel carrier tape (unit : mm) (unit : mm) type (inch size) dimensions (mm) abc eraw (0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 erav (0603) 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0 eras (0805) 1.0 to 1.4 3.2 to 3.8 0.9 to 1.4 type kind of taping pitch (p 1 )quantity eraw punched carr ier taping 2 mm 1 0000 pcs./reel erav 4 mm 5 000 pcs./reel eras type a b w f e p 1 p 2 p 0 d 0 t eraw 0.67 ?.05 1.17 ?.05 8.00 ?.20 3.50 ?.05 1.75 ?.10 2.00 ?.10 2.00 ?.05 4.00 ?.10 1.50 +0.10 0.52 ?.05 erav 1.10 ?.10 1.19 ?.10 4.00 ?.10 0.70 ?.05 eras 1.65 ?.15 2.50 ?.20 0.84 ?.05 ? type a n c w 1 w 2 eraw 18 0.0 +0 60 +1.0 13.0 ?.2 9.0 +1.0 11.4 ?.0 erav eras ?.5 0 0 sep. 2010 00
metal film thermosensitive chip resistors design and speci? cations are each subject to change without notice. ask factory for the current technical speci? cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. preheating peak heating temperature time temp erature time preheating 140 c to 160 c 60 s to 120 s main heat ing above 200 c 30 s to 40 s peak 235 5 c max. 10 s temp erature time preheating 150 c to 180 c 60 s to 120 s main heat ing above 230 c 30 s to 40 s peak max. 260 ? max. 10 s for soldering f or lead-fre e soldering temp erature tim etemperaturetime preheating 140 c to 180 c 60 s to 120 s 150 c to 180 c 60 s to 120 s soldering 245 ?5 c 20 s to 30 s max. 260 c max. 10 s recommended soldering conditions recommendations and precau tions are described below. recommended so ldering conditions for re ow for solderin g (example : sn/pb) for lead-fre e soldering (example : sn/ag/cu) recommended solderin g conditions for ow safety precautions the following ar e precautions for individual products. please also refer to the precautions common to fixed resistors shown on page er2 of this catalog. 1. keep th e rated power and ambient temperature within the speci ed derating curve. * when positioning and mounting metal film thermosensitive chip re sistors (hereafter called the resistors), make allowance for the effect of heat generated through close contact between the resistors and neigh bor ing components and for the temperature rise of adjacent heat-generating components. 2. if a transien t load (heavy load in a short time) like a pulse is expe cted to be applied, check and evaluate the operations of the resistors when installed in your products before use. when app lying pulses to the resistors, keep the pulse peak within the rated voltage. 3. do not us e halogen-based or other high-activity ux. otherwise, the residue may impair the resistors' per for mance and/or re liability. 4. when soldering with a soldering iron, never touch the resist ors' bodies with the tip of th e soldering iron. when using a soldering iron with a high temperature tip, nish soldering as quickly as possible (within three seconds at 350 c max.). 5. as the amount of applied solder becomes larger, the me chanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. avoid applying an excessive amount of solder. 6. when the resistor s' protective coat ings are chipped, awed, or removed, th e characteristics of the resistors may be impaired. take special care not to apply mechanical shock during automatic mounting or cause damage during handling of the boards with the resistors mounted. 7. d o not appl y shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 8. avoid excessive bend ing of printed circuit boards in order to protect the resistors from abnormal stress. 9. do no t immerse the resistors in solvent for a long time. befo re using solvent, carefull y check the effects of im mer sion. ?re ow soldering shall be performed a maximum of two times. ?please contact us for additional information when used in conditions other than those speci ed. ?please meas ure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. sep. 2010 00
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